Vertiv Introduces Ai Power & Cooling Solutions
Vertiv's new high-density data center solutions designed to meet the increased cooling & power
Vertiv has introduced a new range of high-density data center solutions, Vertiv 360AI, to cater to the increased cooling and power needs of accelerated computing. These solutions are designed to speed up AI adoption with pre-engineered infrastructure, digital management, and end-to-end service, resulting in faster deployment compared to traditional methods.
Vertiv 360AI streamlines the process of powering and cooling AI workloads of all sizes. It includes power, cooling, enclosures, services, and digital management. By eliminating design cycles and reducing installation issues, Vertiv 360AI enables quicker deployment. These solutions offer flexibility by reusing existing cooling systems to lower deployment costs.
Brad Wilson, Vertiv's vice president of technology, stated, "Vertiv 360AI simplifies the path to scalable AI infrastructure, addressing challenges faced by data center professionals and systems integrators." The range supports AI applications from testing to full-scale data centers, with initial models capable of powering and cooling up to 100kW per rack. Cooling options include air-to-liquid, liquid-to-air, liquid-to-liquid, and liquid-to-refrigerant models, along with prefabricated modular solutions.
