According to the latest publication from Meticulous Research®, the 3D sensing and imaging market is expected to reach $115.3 billion by 2029, at a CAGR of 24.1% during the forecast period 2022–2029. The growth of this market is attributed to the surge in demand for 3D sensing integrated devices, rising use of VCSELs over LEDs, growing demand for ADAS, increasing emphasis and investment for cutting-edge security & surveillance solutions, and growing demand for 3D image sensors across various verticals.
In addition, the rising demand for optical 3D sensing in industrial applications, increasing government initiatives to support industrial automation, growing awareness regarding the benefits of 3D imaging technology in the medical field/imaging, the rising popularity of drone cameras, and growing demand for 3D accelerometers in smartphones and gaming consoles are expected to offer significant opportunities for growth of this market. However, the high installation cost is hindering the implementation of 3D sensing and imaging technologies. Also, the limitation of connected devices is a major challenge to the growth of this market.
Based on geography, the 3D sensing and imaging market is segmented into North America, Europe, Asia-Pacific, Latin America, and the Middle East & Africa. In 2022, the North America region is estimated to account for the largest share of the 3D sensing and imaging market.
The growth of this region is attributed to the rising demand for 3D sensing optical technologies such as face recognition, facial payments, animoji creation, and augmented/virtual reality in various sectors; a surge in demand for virtualized solutions in the robotics industry; increasing investments for R&D process and widespread adoption of the 3D technology; high dependency of the movie industry on motion capture technology; the high adoption of advanced technologies; and the existence of key market vendors and their forthcoming products. However, the Asia-Pacific region is projected to register the highest CAGR during the forecast period.
Key Players
The key players operating in the 3D Sensing and imaging market are Infineon Technologies AG (Germany), Microchip Technology Inc. (U.S.), KEYENCE CORPORATION (Japan), Google (U.S.), Autodesk Inc. (U.S.), Rockwell Automation, Inc. (U.S.), Cognex Corporation (U.S.), STMicroelectronics (Switzerland), OMNIVISION (U.S.), SICK AG (Germany), Panasonic Life Solutions India Pvt. Ltd. (Japan), Sony Corporation (Japan), Lumentum Operations LLC (U.S.), FARO (U.S.), Occipital, Inc. (U.S.), LMI TECHNOLOGIES INC. (Canada), VIAVI Solutions Inc. (U.S.), Trimble Inc. (U.S.), General Electric Company (U.S.), Balluff GmbH (Germany), and Lockheed Martin Corporation (U.S.).
Scope of the Report:
3D Sensing and Imaging Market, by Type
3D Sensing and Imaging Market, by Technology/Modality
3D Sensing and Imaging Market, by Application
3D Sensing and Imaging Market, by End-Use Industry
Key questions answered in the report-